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Our track record as an experienced innovation leader is a result of focusing on key issues and challenges within the semiconductor technology roadmap, enabling us to make the greatest difference to our customers. While these issues may change over time, one thing will always remain the same: we will continue to transform the results of our breakthrough technologies into volume manufacturing, benefiting our customers.


Our mission is to provide our customers with the most advanced, cost-effective, and reliable products, service and global support network in the semiconductor industry and beyond. We advance the adoption of our technology platforms by developing new materials and process applications that support our customers’ long-term technology roadmaps. Our ALD technique provides us with a platform for a whole new generation of technologies and processes, and acts as a strategic enabler for our business.


We aim to delight our customers, employees and shareholders by driving innovation with new technologies and delivering excellence with dependable products. By doing this, we will create new possibilities for everyone to learn, create and share more of what they love.


Our strategic objective is to realize profitable, sustainable growth by capitalizing on our innovative strength, operational excellence, our leadership in ALD, and our strong relationships with key customers. We have also integrated corporate responsibility (CR) into our strategic goals, and aim to continue to help improve the quality of people’s lives.

The key elements of our strategy are:


We have always been recognized for our technology leadership. Today, we provide leading technologies that support our customers in staying on the curve of Moore’s Law. Our innovative strength is what differentiates us in the marketplace and continues to be the cornerstone of our strategy. Apart from our internal R&D efforts, we are continuously expanding and deepening our strategic cooperation with key customers, suppliers, chemical manufacturers and research institutes such as imec. We also expand our patent portfolio.


ALD technologies are established as mainstream technologies in high-volume manufacturing, supporting virtually all of the leading customers in the semiconductor industry. As a leader in this space, ALD has turned into a key growth driver for our business. We expect that the trends of continued scaling and evolution towards 3D device structures will further expand the number of applications for ALD. We aim to maintain our leading position in ALD by leveraging on our strong expertise and established customer relationships, and by developing new applications to support our customers with increasingly complex device node transitions.


While technology leadership remains crucial, we continue to focus on further improving the effectiveness of our organization and the efficiency of processes. We aim to provide our customers with dependable leading-edge products and services at a consistent quality level, providing the best cost of ownership. To help achieve this, we continue to optimize our manufacturing and global sourcing processes, including the migration to common product platforms.


We believe that being a responsible company creates value for our company, our stakeholders and society, which is why we have integrated CR into our strategic goals. Our goal is to manage all aspects of our business responsibly to meet or exceed stakeholder expectations, while holding our suppliers to high standards. This will enable us to continue to help improve the quality of people’s lives.


Within wafer processing, we focus primarily on equipment and process solutions for the deposition of thin films. Our core strengths are in ALD, Epitaxy, Plasma Enhanced Chemical Vapor Deposition (PECVD), Low Pressure Chemical Vapor Deposition (LPCVD) and Oxidation/Diffusion. With this broad portfolio of technologies, we are addressing many of the key areas on the semiconductor industry roadmap, including:

  • high-k metal gate;
  • new applications for advanced FinFET transistors;
  • dielectrics for spacer-defined double patterning;
  • liners and spacers;
  • low-k dielectrics for interconnect; and
  • strained silicon.

Our breakthrough technologies enable the industry to move to smaller line widths and better transistors that use new materials. In addition to addressing the technology needs of our customers, in order to meet the requirements of the industry to reduce costs, we focus on further increasing equipment throughput and equipment reliability, further lowering the cost per wafer of our wafer processing systems. In addition, to enable further efficiencies in our manufacturing process, we exert significant effort on improving the level of standardization in our equipment portfolio by migrating to common platforms, sub-assemblies and components.