MISSION, VISION, STRATEGY AND FOCUS AREAS
Our track record as an experienced innovation leader is the result of focusing on key issues and challenges within the semiconductor industry, enabling us to make a difference to our customers, employees, and company stakeholders. While issues may change over time, we will continue to transform the results of our breakthrough technologies into volume manufacturing, benefiting our customers.
Our mission is to provide our customers with the most advanced, cost-effective, and reliable products, service, and global support network in the semiconductor industry and beyond. We advance the adoption of our deposition technology platforms by developing new materials and process applications that support our customers’ long-term technology roadmaps.
We aim to delight our customers, employees, and shareholders by driving innovation with new technologies and delivering excellence with dependable products. By doing this, we will create new possibilities for everyone to learn, create, and share more of what they love.
Our strategic objective is to realize profitable, sustainable growth by capitalizing on our innovative strength in deposition technologies and our strong relationships with key customers. We act thereby as a responsible citizen.
The key elements of our strategy are:
› INNOVATIVE STRENGTH
We are recognized for our technology leadership. We provide leading thin film deposition technologies that support our customers in staying on the curve of Moore’s Law. Our innovative strength is what differentiates us in the marketplace, creates growth opportunities for our employees, and continues to be the cornerstone of our strategy. Apart from our internal R&D efforts, we are continuously expanding and deepening our strategic cooperation with key customers, suppliers, chemical manufacturers, and research institutes such as imec. Our suppliers manufacture advanced components and assemblies to the tightest of tolerances and are required to adhere to our stringent design specifications, quality systems, and corporate responsibility requirements. This approach enables us to remain innovative and swiftly meet the changing demands of our customers.
› LEADERSHIP IN DEPOSITION
We create value through our advanced thin film deposition technologies, which help leading semiconductor and technology industry partners to deliver the world of tomorrow through advanced chips. One of these technologies is ALD, which is established as a mainstream technology in high-volume manufacturing, supporting virtually all of the leading customers in the semiconductor industry. As a leader in this space, ALD has turned into a key growth driver for our business. We expect that the trends of continued scaling and evolution towards 3D device structures will further expand the number of applications for ALD. We aim to maintain our leading position in ALD by leveraging on our strong expertise and established customer relationships, and by developing new applications in deposition technologies to support our customers with increasingly complex device node transitions.
Within wafer processing, we focus primarily on equipment and process solutions for the deposition of thin films. Our core strengths are in ALD, epitaxy, plasma enhanced chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD) and oxidation/diffusion. With this broad portfolio of technologies, we are addressing many of the key areas on the semiconductor industry roadmap, including:
- high-k metal gate;
- advanced FinFET transistors;
- dielectric spacers for multiple patterning;
- advanced 3D memories;
- liners, etch stops, and spacers;
- low-k dielectrics for interconnect; and
- strained silicon for transistor channel engineering.
Our breakthrough technologies enable the industry to move to smaller line widths and better transistors that use new materials. We focus on serving the top companies that produce logic chips and memory devices, which includes addressing the needs of top foundries. By serving the leading chipmakers, we maintain an understanding of the important requirements of the next generation of device roadmaps, enabling us to develop value-added solutions to the industry’s critical issues. In many cases, new films developed for one device type can be utilized for other device types with relatively limited additional development.
› OPERATIONAL EXCELLENCE
While technology leadership remains crucial, we have a responsibility to our stakeholders to continue to focus on further improving the effectiveness of our organization and the efficiency of processes. We aim to provide our customers with dependable leading-edge products and services at a consistent quality level, providing the best cost of ownership. To help achieve this, we continue to optimize our manufacturing and global sourcing processes, including the migration to common product platforms. We are working with our suppliers to improve fundamental quality through statistical methods and process controls. Our employees are engaged in an improved product life cycle process and our Product Safety Council is focused on further improving product safety through fundamental design.
In addition to addressing the technology needs of our customers, we also focus on further increasing equipment throughput and equipment reliability, thereby lowering the cost per wafer of our wafer processing systems. Combined with our commitment to quality, we continuously strive to achieve industry-leading productivity. In addition, to enable further efficiencies in our manufacturing process, we exert significant effort on improving the level of standardization in our equipment portfolio by migrating to common platforms, sub-assemblies and components.