We are the leading supplier of atomic layer deposition (ALD) equipment and process solutions for the semiconductor industry, and were one of the first companies to recognize ALD’s potential for the industry. Today, our ALD process technology delivers the highest performance available to support the next generation of semiconductor devices.
ALD allows us to deposit thin films atom-by-atom on silicon wafers, meaning we can deliver atomic-scale thickness control, high-quality deposition film properties and large area uniformity.
With such precision, we can use materials that previously could not be considered, and develop 3D structures that are vital to the future of electronics. 3D technology provides a number of real benefits, including saving space while delivering chips with higher performance and consuming less power.
ALD IN VOLUME MANUFACTURING
Our ALD technology is being used to build ICs for a wide range of leading-edge products, including high-performance computers and smartphones. The results of ALD are everywhere in the world around us.
ALD is also our basic platform for the development of a wide range of new materials. Our research centers across the globe are working on ALD, and we are conducting joint research projects with Europe’s largest independent research institute, imec. Taken together, this helps make ALD one of the principal drivers for future growth in microelectronics.
ALD – A DRIVER OF FUTURE GROWTH
Using ALD, we can deposit new materials several atoms thick on semiconductor wafers, producing ultra-thin films of exceptional quality and uniformity.
In PEALD, plasma is used to provide the reaction energy for the process, enabling us to use lower temperatures for low-thermal budget applications. This technology was introduced in DRAM and planar NAND flash manufacturing in the 3x nm node, for spacer-defined double patterning (SDDP), a technique that can reduce device dimensions, postponing the need for new lithography technologies.
Using ALD technology, we can scale devices to smaller dimensions while reducing the power consumption of transistors, all of which helps the industry follow Moore’s Law and create smaller, more powerful semiconductors. For advanced 3D memory applications, where devices are stacked vertically in high densities, ALD is critical for uniformly depositing films in deep trenches and over complicated features. Many new applications are emerging where ALD is the technology of choice, and in a number of cases the only solution that meets the challenging technology requirements.
We expect ALD to be one of the principal drivers of growth in microelectronics over the coming decade. In addition, we expect growth in other deposition technologies, including epitaxy for advanced transistors and PECVD for creating improved interconnects. Looking ahead, we will continue to develop the huge potential of our deposition technologies in support of the semiconductor industry, enabling the industry to support the future demands of consumers and businesses.